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Innovative Thermal Solution

TEL. +81-42-520-8223

No. 6-39-21, Nishisuna-cho, Tachikawa-shi,
Tokyo 190-0034, Japan

PRODUCT

Vapor chamber principle

The principle of Vapor chamber technology

A vapor chamber is a vacuum receptacle with an inner fin structure supported by the inside walls. The vapor chamber is filled to a set percentage with a specified liquid. When a heat source is attached to a vapor chamber, the working liquid at the heat source vaporizes instantly and the vapor rushes to fill the entire chamber. This vapor will condense when it contacts the cooler sides of the wall; this initial vaporization of the liquid and consequent return to a liquid state, becomes a highly efficient heat exchange system. The condensed liquid is then returned to the heat source via the inner fin action, ready to be vaporized again, repeating the cycle for as long as the heat source maintains a need for such heat exchange.



Al vapor chamber heat-sink technology

The difference between Al and Cu vapor chamber heat-shinks:





WHY Al vapor chamber heat-sink?

• Lower cost of aluminium V.S. copper
• Lighter weight and greater strength
• Flexible and retains shape of inner design features regardless of
  exterior adaptation.
•30% faster heat transfer on average by using refrigerant as
  working fluid.
•Post machining is not required as the fin and the heat-sink are
  welded in one working process.
• 100% aluminum, 100% recyclable, environment friendly
  (including R436a a refrigerant with a GWP rating of 3.0).


 


Applications for Al vapor chamber heat-sink

EV (Electric Vehicle) / HEV(Hybrid electric vehicle)


Currently, a major bottle-neck for EV development comes from battery and motor issues. However, the heat management issues for each of the electric components is also of major importance. Al vapor chamber heat-sinks offer excellent results for the following components:

Heat exchangers for inside of the vehicle:
•Highpower LED headlamp
•IGBT module for Inverter / converter
•Junction boxes, battery packs
•PCU (power control unit)...etc

The power quick charging station:
•Inverter

High power IGBT inverter

The current common solution for the thermal management of high power IGBT modules is to use either larger extruded heat sinks, or to use water cycling heat plates. Extruded heat sinks add to the problem of inefficient heat exchange and contribute to a greater weight. In the case of water cycling heat plates, the problem of high cost is exacerbated by the use of addition components, such as pumps. Water cycling heat plates or any water-based cooling systems is likely to add the serious problem of water leakage as well. Our innovation of a non water-based Al vapor chamber heat sink provides lower cost and an efficient heat exchange solution while eliminating potential water leakage.

 

Semiconductor devices, communication devices, IC chips

Heat pipe based heat sinks are an older but commonly used thermal device for semiconductors or IC chips. However, faced with high power output, the heat pipe heat sink becomes inefficient due to the limited thermal transfer from the heat pipe technology.

If an Al vapor chamber heat sink solution is used, the heat transfer becomes faster while providing a larger direct contact area to the heat sources. In addition, the working coolant used within the vapor chamber reacts immediately in response to a heat source.

With the greater efficiency of heat transfer, the lighter weight of the unit and the reduced footprint of an Al vapor chamber heat sink, it contributes to an overall greater efficiency to the heat-producing component.

 

High power LED lighting

LED lighting represents a new generation of energy saving lighting. However, this new LED lighting also faces the same thermal challenges common to other IC components. Improved thermal management creates higher component efficiency.

When using an Al vapor chamber heat sink, the higher heat transfer rate will be increased by the action of the coolant within the vapor chamber.

An additional problem with the current heat pipe heat sink is a common problem called “dry out”. In order to eliminate that problem, the heat pipe is usually equipped with a fan, which creates two problems: one is addition energy consumption and the other is noise.

When using an Al vapor chamber heat sink solution, often no fan is required. Additionally, the lighter weight and lower cost will add benefit to the LED lighting design.

* For catalog or any inquiry, please feel free to contact us


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LEADING EDGE ASSOCIATES

No. 6-39-21 Nishisuna-cho, Tachikawa-shi,
Tokyo 190-0034, Japan

TEL +81-42-520-8823
FAX +81-42-520-8824
info@alvc.jp